Electroplating equipment How about electroplating process in
The electroplating technology of gold plating equipment, also known as electroigneous rock, is the fourth key way to obtain the metal material layer on the surface of raw materials. This process is the whole process of making the metal material igneous rock in the aqueous solution enter the igneous rock surface by using the AC electric field and the control circuit composed of anode and cathode in the electrolyte (plating solution); Current efficiency: the proportion of electricity used for igneous rock metal materials in the total electricity consumption is called electroplating process.
Dispersion ability: the dispersibility of the plating solution refers to the ability to make igneous rock metal materials evenly distributed on the surface of the cathode piece under certain standard conditions. Aluminum coating process: the whole process of forming uniform and fine coating of positive ions of two or more metal materials in cathode co igneous rock is called aluminum alloy coating (generally speaking, multi-component shall at least exceed 1%).
Flatness: Flatness (that is, the working ability of external force in the case of economic dispersion) refers to that when a coating is formed on the passive surface of stainless steel, the external economy of the coating is better than the working ability of the surface layer. This method shows that the surface roughness of the base metal material is small, the depth of the wave cavity is 1 less than 0.6 mm, and the coating is evenly covered when the interval between the wave crest and the wave trough is not large.
Needle or pitting: the chlorine bubbles are attached to the cathode surface to prevent the igneous rock of metal materials in this part. Only the igneous rock is located around the bubbles. If the chlorine bubbles stay on the cathode surface layer throughout the electroplating process, the coating will have holes or gaps through the whole line. The chlorine bubbles are not firmly adhered during the electroplating process, but only intermittently replaced and adhered, Such position will form shallow pits or pits, which are usually called pinholes or pockmarks in the industrial production of electroplating process.
Vaporization: after the electroplating process, with the increase of the temperature of the surrounding medium, the hydrogen absorption in the base metal material will gather in the base metal material, forming small bubbles, which will seriously damage the quality of the coating. This phenomenon is particularly obvious in phosphating, cadmium, lead and other metal materials. Covering capacity: The covering layer (or working capacity of deep coating) is an important performance parameter in the plating solution, that is, according to the specified standards, the igneous rock metal materials are placed on the surface of the cathode parts and covered completely.
Under specific conditions, the working ability of the coating of igneous rock metal materials with grooves or deep holes refers to the coating fineness on the surface of parts. Hydrogen embrittlement: after cathodic reduction, hydrogen oxide ions will produce some chlorine gas to escape, and some will penetrate into the base metal materials (especially high toughness metal composites) and coatings with molecular hydrogen, which will reduce the ductility of the base metal materials and coatings and become brittle. This behavior is called "hydrogen embrittlement".
