How to use Electroplating equipment
Everyone is right Electroplating wastewater treatment equipment How much do you know? In China, the environment has been seriously polluted, so the electroplating wastewater treatment equipment is also to meet the environmental protection and resource conservation. So, do you know how to use the electroplating wastewater treatment equipment? Next, let's take a look at the specific use of electroplating wastewater treatment device.
Primary sedimentation tank: the primary sedimentation tank of equipment is a vertical DC sedimentation tank. The rise and fall rate of sewage in sedimentation tank is 0.6~0.7 mm/s. These sediments are lifted to the sludge tank through air. Contact oxidation tank: after initial sedimentation, the water enters the contact tank for biochemical treatment. The contactor is divided into three sections, and the total residence time is more than 1 hour. The test results show that the enhanced contact oxidation time can reach 6 hours, which is a new trapezoidal filler. Secondary sedimentation tank: flows into the secondary sedimentation tank after biochemical treatment. The secondary sedimentation tank is a parallel flow DC sedimentation tank. Sterilizer: the sterilizer can extend the disinfection time by 1-1.5 hours, and solid chlorine contact disinfection method is adopted; The disinfection device of electroplating wastewater treatment equipment can continuously change the dosage according to different water output to achieve a larger dosage. The purpose is to reduce water content and dosage. Other disinfection equipment can be prepared separately.
Sludge tank: all sludge generated from the primary and secondary sedimentation tanks is pneumatically lifted to the sludge tank of the reclaimed water recovery unit for aerobic digestion. Effluent from the sludge tank returns to the contact oxidation tank for further treatment. Fan room and fan: the fan room of reclaimed water recovery equipment is located above the disinfection pool. Double layer sound insulation at the entrance. The air inlet is equipped with muffler and fan filter, which makes no noise during operation. For the treatment of mixed heavy metal wastewater, it is difficult to treat electroplating wastewater. The water quality of heavy metal wastewater treatment in electroplating plant is complex, and the composition is difficult to control. It contains cyanide, acid, alkali, hexavalent chromium, copper, zinc, cadmium, nickel, gold, silver and other heavy metal pollutants, which are extremely toxic. Some of them are carcinogenic, teratogenic and mutagenic substances.
Electroplating is to deposit a thin functional coating on the part substrate to make it have certain special functions, also known as functional electroplating. Functional electroplating is also one of the most widely used electroplating processes at present. It plays an important role in industrial development, plays an irreplaceable role in electronics, materials, machinery, aerospace and other industries, and becomes an important supporting force for modern industrial development. Electroplating methods mainly include: gold, silver, tin, plastic electroplating, chemical plating, etc. Generally speaking, there are the following applications:
1) Improve the conductivity of the product: achieve the big function effect of Z with less metal resources. Therefore, during industrial production, plating a layer of gold and silver on the copper or zinc alloy substrate can obtain excellent conductivity and low resistance of gold and silver, which can achieve industrial applications that can not be achieved by a single precious metal product. This method has been widely used in the electronic industry, mainly including gold, silver and nickel alloys;
2) Improve the solderability of the product: improve the solderability of the product by electroplating a layer of tin lead alloy without affecting the conductivity, mechanical and other functions; Especially, the surface treatment technology of mechanical assembly is very important in the electronic industry.
3) Plating and metallization of non-metallic materials: represented by plastic electroplating. The maturity of plastic plating technology has led to the rapid development of new material industries such as plastics, making integrated circuits in the electronic industry possible, and also driving the entire electronic industry, represented by the representative PCB plastic circuit board electroplating process.
