Electroplating equipment After determining the formula of the electroplating solution, electrolytic deposition is finally carried out with low current density. Generally, the amount of sodium cyanide added is 1.15 times that of cuprous cyanide; Copper in Yakaki is not easily soluble in water, and additives such as viscous surfactants or polymers should be dissolved in a small amount of water before being added to the tank.
For example, cuprous cyanide can be dissolved only after adding sodium cyanide as the additive, and it should be dissolved with ethanol first. To remove other metal ion impurities until the solution is suitable for operation. Stir immediately after adding water. The magazines contained in the solution can be removed by various chemical methods and treated with activated carbon. Adjust the bath process specification PH value, temperature, additives, etc. To select qualified drugs, deionized water can be used to prepare electroplating solution if conditions permit, or tap water can be used to prepare, for example, a drug of 100kg is required, but some plating seeds must use deionized water, such as silver plating solution, because chloride ions will generate silver chloride precipitation with silver ions!
The elements of daily management of variable parameters of electroplating process mainly include the following.
(1) Temperature management
The influence of temperature on electroplating has been introduced in detail. Temperature has an important influence on the surface quality and efficiency of electroplating. Therefore, all plating seeds that need to be heated should be equipped with thermostatically controlled heating equipment, and employees are required to record the temperature of the plating solution. Of course, from the perspective of energy conservation, the process at room temperature should be used as far as possible. However, some plating seeds can only work at a certain high temperature at present. The key is to strengthen management to prevent waste of energy and evaporation of plating solution caused by overheating.
The temperature management is not limited to the plating tank, and the temperature of hot water washing should also be managed. Many electroplating enterprises only pay attention to the temperature control of the plating tank, regardless of the hot water, either insufficient heating or excessive heating, which is adverse to the quality and also wastes resources.
(2) Bath pH management
The pH value of the plating solution is a relatively hidden change factor, which is often found when something goes wrong. Therefore, it is absolutely necessary to frequently detect the pH value of the plating solution. For plating seeds with strict requirements, it is better to use digital pH display controlled by sensor. In this way, the pH value of the plating solution can be known in time. The easiest way is to use precision test paper for on-site measurement. The operator shall also have test paper available. Do not have test paper only for craftsmen. This can ensure that the pH value of the plating solution is monitored by more people.
(3) Bath composition management
The management of bath composition is mainly to obtain information through chemical analysis. It is easier to set up organizations with enterprises or departments' own chemical analysis rooms. Regular sampling test as required is enough.
Electroplating enterprises that do not have their own analysis room, because it is troublesome and expensive to take the plating solution out for analysis, set the analysis cycle of the plating solution very long, exceeding the normal required analysis time. The composition of the plating solution is out of balance, and it is often necessary to analyze and supplement materials when there is a problem.
Therefore, it is necessary to calculate the basic law of bath composition consumption according to the production frequency and material consumption, or according to the plating area, etc., so as to conduct regular analysis of the plating solution. When the processing amount is large, it should be analyzed every one or two days, and when the processing amount is small, it should be analyzed at least once a week. At the same time, the process personnel should conduct Hall cell test on the plating solution regularly to determine that the plating solution is in the best process range. Hall cell test is not only an important tool for electroplating process development, but also an important means for electroplating site management.
